Sr. IC Packaging Engineer

Uniquify, Inc. is a privately held, rapidly growing system-on-chip (SoC) design, integration and manufacturing services supplier, and innovative developer and provider of high-performance adaptive IP. Our “ideas2silicon” services range from spec development and front-end design through physical design to delivery of packaged, tested chips. Uniquify’s San Jose headquarters is its primary design center but additional design teams are headquartered in Vietnam, India, Korea, Japan, and China.

Job Description

The Sr. IC Packaging Engineer will provide project management, package design/development and support for high performance IC or semiconductor assemblies, and/or completed units.

The individual will be responsible for influencing the architecture/design, materials selection and structural integrity of high performance IC packages and other associated components and collateral’s under manufacturing, test and usage conditions.

Focus on package layout design, SI/PI analysis and testing of microelectronic packages. Is expected to identify, assess and/or develop key analytical techniques to enable/suggest package vendors to improve various electrical performance. As part of the job function, candidate will also be expected to interact with other engineers/vendors/contractors to define and execute validation experiments as part of package design process.


The ideal candidate should possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your school work/classes/research and/or relevant previous job and/or internship experiences.

*Minimum Qualifications:

  • The candidate must possess a BS/MS in Mechanical / Mechanics / Electrical / Material Engineering, or a related discipline
  • ~7+ years of experience in electronics packaging in related environment
  • Solid technical understanding of full range of PCB technology, semiconductor packaging materials
  • Practical experience of substrate layout design with high speed interface such as Serdes over 3+Gpbs with multiple layers ~ 10
  • Deep knowledge of Signal integrity analysis and power analysis for various high speed interface such as Serdes is a must
  • Knowledge of package qualification and reliability methods and failure analysis is a plus
  • Excellent communication skills
  • Applicants must have a legal right to work in the US without sponsorship

*Preferred Qualifications:

  • Willingness to travel internationally
  • IC Packaging & PCB technologies, system design

Job Type

Full time; local candidates only

Benefits offered

  • Medical, Dental, and Vision
  • 401K
  • Gym Membership
  • Vacation days
  • Sick days


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"Our working environment is always an open learning environment, where nobody hesitates to ask questions and everyone freely shares knowledge. The youthful and energetic nature of our company is one of our greatest assets, enabling our engineers to grow in knowledge and experience at a very fast pace – a single year working at Uniquify is worth several at another company."
Marcus Wei, Manager, ASIC Engineering